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1 Board fabrication2 Bill of materials3 Assembly data4 Design reference5 Mechanical and box build6 Firmware and programming7 Test8 Labels and packaging9 Revision control10 Before the build
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Date 1 Board fabrication1.1 Layer data is in Gerber X2, ODB++, or IPC-2581.Older Gerbers carry no layer function, so the fab has to work out which file is which. 1.2 Drill files keep plated and non-plated holes clearly separate. 1.3 Stackup and impedance requirements state layer count, copper weights, dielectrics, target impedances, tolerances, and reference layers. 1.4 The fab notes say whether the fab may adjust trace widths to hit impedance targets. 1.5 The fabrication drawing states material, finish, mask and silkscreen colors, IPC-6012 or IPC-6013 class, outline tolerances, and special features. 1.6 An IPC-D-356 test netlist is included if you send Gerbers. 1.7 Panel requirements say who designs the panel, with fiducials, tooling holes, and tabs or V-score. 2 Bill of materials2.1 Every line has reference designators, quantity, manufacturer, and manufacturer part number.A distributor stock number alone is not enough; the assembler may buy elsewhere. 2.2 Critical and long-lead parts have approved alternates listed.Without them, every shortage becomes a phone call and a delay. 2.3 Every part is active, in stock in the build quantity, and not marked not recommended for new designs. 2.4 Passive lines specify tolerance, voltage rating, dielectric, and package, not just a value.A value and size alone leave the assembler to choose the rest. 2.5 Parts with no schematic symbol are in the BOM: labels, gaskets, light pipes, screws, and standoffs.Nobody draws them on the schematic, so they are easy to leave out. 2.6 Moisture-sensitive parts are identified so the assembler handles them correctly. 3 Assembly data3.1 Pick-and-place data covers position, rotation, and side for every part, in the same units and origin as the board data. 3.2 The BOM and pick-and-place data agree: no missing parts, no extras, and rotations that match the footprints. 3.3 DNP parts agree across the BOM, pick-and-place, and assembly drawing.A part that is DNP in the BOM but present in the placement file can easily get placed. 3.4 Stencil requirements are stated where defaults will not do: thickness, step areas, and thermal pad apertures. 3.5 The assembly drawing shows polarity, pin 1, hand-soldered parts, adhesive, coating keep-outs, and heat sinks. 3.6 Parts whose pin 1 or polarity marking varies between vendors have explicit orientation notes. 3.7 Lead-free or leaded assembly and the IPC-A-610 acceptance class are stated. 9 Revision control9.1 Every file carries the same release revision, in its title block, file name, or both.When revisions disagree, the manufacturer cannot tell which file is right. 9.2 The package is one archive named with the product and revision, with a readme listing contents, date, and contact. 9.3 Outputs are generated by script from a tagged source revision.Hand-built packages drift: an output setting changes or a file comes from the wrong revision. 9.4 Design and electrical rule checks pass on the released revision. 9.5 The released set is read-only, and any change is a new revision with a note on what changed. 9.6 The engineering change order process is agreed with the manufacturer: what changed, why, which units, and what happens to stock. 